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658-60ABT3
658-60ABT3 -
Heatsink; Omnidirectional; 15.2mm; Black Anodized; with Tape
聲明:圖片僅供參考,請(qǐng)以實(shí)物為準(zhǔn)!
制造商:
Wakefield
Wakefield
制造商產(chǎn)品編號(hào):
658-60ABT3
倉(cāng)庫(kù)庫(kù)存編號(hào):
70236703
技術(shù)數(shù)據(jù)表:
Datasheet
訂購(gòu)熱線:
400-900-3095 0755-21000796, QQ:
800152669
, Email:
sales@szcwdz.com
由于產(chǎn)品數(shù)據(jù)庫(kù)龐大,部分產(chǎn)品信息可能未能及時(shí)更新,下單前請(qǐng)與銷售人員確認(rèn)好實(shí)時(shí)在庫(kù)數(shù)量,謝謝合作!
658-60ABT3產(chǎn)品概述
Omnidirectional Pin Fin Heat Sink for BGAs and PowerPC™
658-60ABT3產(chǎn)品信息
Application
Integrated Circuits
Brand/Series
658 Series
Color
Black
Configuration
Omnidirectional
Dimensions
1.1 Sq. in.
Finish
Black Anodized
For Use With
BGA
Height, Above PC Board
0.6 in.
Material
Aluminum
Mounting Style
Omnidirectional
Package Type
BGA
Primary Type
BGAs/PowerPC?
Special Features
Omnidirectional Fin Pin
Thermal Resistance
2 °C/W
Type
Omnidirectional
Weight
14.17 g
關(guān)鍵詞
658-60ABT3客戶還搜索了
參考圖片
制造商 / 說(shuō)明 / 型號(hào) / 倉(cāng)庫(kù)庫(kù)存編號(hào)
PDF
操作
Wakefield
Heatsink; Omnidirectional; 21 mm; Double Tape
型號(hào):
624-25ABT4E
倉(cāng)庫(kù)庫(kù)存編號(hào):
70236700
搜索
658-60ABT3相關(guān)搜索
Application Integrated Circuits
Wakefield Application Integrated Circuits
Heatsinks Application Integrated Circuits
Wakefield Heatsinks Application Integrated Circuits
Brand/Series 658 Series
Wakefield Brand/Series 658 Series
Heatsinks Brand/Series 658 Series
Wakefield Heatsinks Brand/Series 658 Series
Color Black
Wakefield Color Black
Heatsinks Color Black
Wakefield Heatsinks Color Black
Configuration Omnidirectional
Wakefield Configuration Omnidirectional
Heatsinks Configuration Omnidirectional
Wakefield Heatsinks Configuration Omnidirectional
Dimensions 1.1 Sq. in.
Wakefield Dimensions 1.1 Sq. in.
Heatsinks Dimensions 1.1 Sq. in.
Wakefield Heatsinks Dimensions 1.1 Sq. in.
Finish Black Anodized
Wakefield Finish Black Anodized
Heatsinks Finish Black Anodized
Wakefield Heatsinks Finish Black Anodized
For Use With BGA
Wakefield For Use With BGA
Heatsinks For Use With BGA
Wakefield Heatsinks For Use With BGA
Height, Above PC Board 0.6 in.
Wakefield Height, Above PC Board 0.6 in.
Heatsinks Height, Above PC Board 0.6 in.
Wakefield Heatsinks Height, Above PC Board 0.6 in.
Material Aluminum
Wakefield Material Aluminum
Heatsinks Material Aluminum
Wakefield Heatsinks Material Aluminum
Mounting Style Omnidirectional
Wakefield Mounting Style Omnidirectional
Heatsinks Mounting Style Omnidirectional
Wakefield Heatsinks Mounting Style Omnidirectional
Package Type BGA
Wakefield Package Type BGA
Heatsinks Package Type BGA
Wakefield Heatsinks Package Type BGA
Primary Type BGAs/PowerPC?
Wakefield Primary Type BGAs/PowerPC?
Heatsinks Primary Type BGAs/PowerPC?
Wakefield Heatsinks Primary Type BGAs/PowerPC?
Special Features Omnidirectional Fin Pin
Wakefield Special Features Omnidirectional Fin Pin
Heatsinks Special Features Omnidirectional Fin Pin
Wakefield Heatsinks Special Features Omnidirectional Fin Pin
Thermal Resistance 2 °C/W
Wakefield Thermal Resistance 2 °C/W
Heatsinks Thermal Resistance 2 °C/W
Wakefield Heatsinks Thermal Resistance 2 °C/W
Type Omnidirectional
Wakefield Type Omnidirectional
Heatsinks Type Omnidirectional
Wakefield Heatsinks Type Omnidirectional
Weight 14.17 g
Wakefield Weight 14.17 g
Heatsinks Weight 14.17 g
Wakefield Heatsinks Weight 14.17 g
郵箱:
sales@szcwdz.com
Q Q:
800152669
手機(jī)網(wǎng)站:
m.szcwdz.com
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