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630-45AB - 

Heatsink; Omnidirectional; 11.4mm; Black Anodized

Wakefield 630-45AB
聲明：圖片僅供參考，請以實物為準！
制造商產品編號：
630-45AB
倉庫庫存編號：
70236685
技術數(shù)據(jù)表：
View 630-45AB Datasheet Datasheet
訂購熱線： 400-900-3095  0755-21000796, QQ:800152669, Email:sales@szcwdz.com
由于產品數(shù)據(jù)庫龐大，部分產品信息可能未能及時更新，下單前請與銷售人員確認好實時在庫數(shù)量，謝謝合作！

630-45AB產品概述

The 630 Series is an omnidirectional pin fin heat sink for both natural and forced-convection applications. Applications include network routers and switches, high-resolution printers, digital cameras, consumer video games, digital video disks (DVD) and global positioning systems (GPS).

630-45AB產品信息

  Application  Integrated Circuits  
  Brand/Series  630 Series  
  Color  Black  
  Configuration  Omnidirectional  
  Dimensions  1.378 Sq. in.  
  Finish  Black Anodized  
  For Use With  BGA  
  Height, Above PC Board  0.45 in.  
  Material  Aluminum  
  Mounting Style  Omnidirectional  
  Package Type  BGA  
  Primary Type  BGAs/Super BGAs/PBGAs/FPBGAs  
  Special Features  Omnidirectional Fin Pin  
  Thermal Resistance  4 °C/W  
  Type  Omnidirectional  
  Weight  6.81 g  
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630-45AB相關搜索

Application Integrated Circuits  Wakefield Application Integrated Circuits  Heatsinks Application Integrated Circuits  Wakefield Heatsinks Application Integrated Circuits   Brand/Series 630 Series  Wakefield Brand/Series 630 Series  Heatsinks Brand/Series 630 Series  Wakefield Heatsinks Brand/Series 630 Series   Color Black  Wakefield Color Black  Heatsinks Color Black  Wakefield Heatsinks Color Black   Configuration Omnidirectional  Wakefield Configuration Omnidirectional  Heatsinks Configuration Omnidirectional  Wakefield Heatsinks Configuration Omnidirectional   Dimensions 1.378 Sq. in.  Wakefield Dimensions 1.378 Sq. in.  Heatsinks Dimensions 1.378 Sq. in.  Wakefield Heatsinks Dimensions 1.378 Sq. in.   Finish Black Anodized  Wakefield Finish Black Anodized  Heatsinks Finish Black Anodized  Wakefield Heatsinks Finish Black Anodized   For Use With BGA  Wakefield For Use With BGA  Heatsinks For Use With BGA  Wakefield Heatsinks For Use With BGA   Height, Above PC Board 0.45 in.  Wakefield Height, Above PC Board 0.45 in.  Heatsinks Height, Above PC Board 0.45 in.  Wakefield Heatsinks Height, Above PC Board 0.45 in.   Material Aluminum  Wakefield Material Aluminum  Heatsinks Material Aluminum  Wakefield Heatsinks Material Aluminum   Mounting Style Omnidirectional  Wakefield Mounting Style Omnidirectional  Heatsinks Mounting Style Omnidirectional  Wakefield Heatsinks Mounting Style Omnidirectional   Package Type BGA  Wakefield Package Type BGA  Heatsinks Package Type BGA  Wakefield Heatsinks Package Type BGA   Primary Type BGAs/Super BGAs/PBGAs/FPBGAs  Wakefield Primary Type BGAs/Super BGAs/PBGAs/FPBGAs  Heatsinks Primary Type BGAs/Super BGAs/PBGAs/FPBGAs  Wakefield Heatsinks Primary Type BGAs/Super BGAs/PBGAs/FPBGAs   Special Features Omnidirectional Fin Pin  Wakefield Special Features Omnidirectional Fin Pin  Heatsinks Special Features Omnidirectional Fin Pin  Wakefield Heatsinks Special Features Omnidirectional Fin Pin   Thermal Resistance 4 °C/W  Wakefield Thermal Resistance 4 °C/W  Heatsinks Thermal Resistance 4 °C/W  Wakefield Heatsinks Thermal Resistance 4 °C/W   Type Omnidirectional  Wakefield Type Omnidirectional  Heatsinks Type Omnidirectional  Wakefield Heatsinks Type Omnidirectional   Weight 6.81 g  Wakefield Weight 6.81 g  Heatsinks Weight 6.81 g  Wakefield Heatsinks Weight 6.81 g  
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QQ:800152669
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