amphenol代理商
專業(yè)銷售Amphenol(安費(fèi)諾)全系列產(chǎn)品-英國2號(hào)倉庫
美國1號(hào)分類選型新加坡2號(hào)分類選型英國10號(hào)分類選型英國2號(hào)分類選型日本5號(hào)分類選型

在本站結(jié)果里搜索:    
熱門搜索詞:  Connectors  8910DPA43V02  Amphenol  UVZSeries 160VDC  70084122  IM21-14-CDTRI

DV-T268-101E - 

Heatsink, D3, TO-268, 31 x 12.7 x 10.16mm, Roller Mount Mount

Ohmite DV-T268-101E
聲明:圖片僅供參考,請(qǐng)以實(shí)物為準(zhǔn)!
制造商:
Ohmite Ohmite
制造商產(chǎn)品編號(hào):
DV-T268-101E
倉庫庫存編號(hào):
70024466
技術(shù)數(shù)據(jù)表:
View DV-T268-101E Datasheet Datasheet
訂購熱線: 400-900-3095  0755-21000796, QQ:800152669, Email:sales@szcwdz.com
由于產(chǎn)品數(shù)據(jù)庫龐大,部分產(chǎn)品信息可能未能及時(shí)更新,下單前請(qǐng)與銷售人員確認(rèn)好實(shí)時(shí)在庫數(shù)量,謝謝合作!

DV-T268-101E產(chǎn)品概述

Ohmite D Series heatsinks provide an innovative solution for SMT compatible semiconductors and resistors. The unique design (Patent Pending) combines tin plated, solderable rods with an aluminum extruded heat sink body. These rods (or “rollers”) are mated mechanically to the heatsink by forging to reduce the thermal resistance between the heatsink body and the solderable feet. Specifically designed for use with the increasingly popular TO-252, TO-263 and TO-268 packages, the D Series affords the user superior thermal performance over the more common stamped aluminum heatsinks. By eliminating the staking joint typically used in stamped heatsinks, the resulting air gap and thermal “bottleneck” is also eliminated, while surface area for cooling is maximized with the extruded fins of the D Series body.

DV-T268-101E產(chǎn)品信息

  Application  Thermal Management, SMT Compatible Semiconductors, Resistors  
  Brand/Series  D Series  
  Dimensions  31mm L x 12.7mm W x 10.16mm H, 1.22" L x 0.5" W x 0.4" H  
  Finish  Degreased  
  For Use With  TO-268  
  Material  Aluminum Alloy  
  Primary Type  TO-268  
  Special Features  Radius Mounted Rollers are Designed for Maximizing Heat Transfer from the Component and Avoiding the Thermal "Bottle-Neck" Seen in Stamped and Staked Heatsinks  
  Thermal Resistance  6 °C/W  
  Type  TO-268  
  Weight  0.145 oz  
關(guān)鍵詞         

DV-T268-101E關(guān)聯(lián)產(chǎn)品

  • 參考圖片
  • 制造商 / 說明 / 型號(hào) / 倉庫庫存編號(hào)
  • PDF
  • 操作

DV-T268-101E相關(guān)搜索

Application Thermal Management, SMT Compatible Semiconductors, Resistors  Ohmite Application Thermal Management, SMT Compatible Semiconductors, Resistors  Heatsinks Application Thermal Management, SMT Compatible Semiconductors, Resistors  Ohmite Heatsinks Application Thermal Management, SMT Compatible Semiconductors, Resistors   Brand/Series D Series  Ohmite Brand/Series D Series  Heatsinks Brand/Series D Series  Ohmite Heatsinks Brand/Series D Series   Dimensions 31mm L x 12.7mm W x 10.16mm H, 1.22" L x 0.5" W x 0.4" H  Ohmite Dimensions 31mm L x 12.7mm W x 10.16mm H, 1.22" L x 0.5" W x 0.4" H  Heatsinks Dimensions 31mm L x 12.7mm W x 10.16mm H, 1.22" L x 0.5" W x 0.4" H  Ohmite Heatsinks Dimensions 31mm L x 12.7mm W x 10.16mm H, 1.22" L x 0.5" W x 0.4" H   Finish Degreased  Ohmite Finish Degreased  Heatsinks Finish Degreased  Ohmite Heatsinks Finish Degreased   For Use With TO-268  Ohmite For Use With TO-268  Heatsinks For Use With TO-268  Ohmite Heatsinks For Use With TO-268   Material Aluminum Alloy  Ohmite Material Aluminum Alloy  Heatsinks Material Aluminum Alloy  Ohmite Heatsinks Material Aluminum Alloy   Primary Type TO-268  Ohmite Primary Type TO-268  Heatsinks Primary Type TO-268  Ohmite Heatsinks Primary Type TO-268   Special Features Radius Mounted Rollers are Designed for Maximizing Heat Transfer from the Component and Avoiding the Thermal "Bottle-Neck" Seen in Stamped and Staked Heatsinks  Ohmite Special Features Radius Mounted Rollers are Designed for Maximizing Heat Transfer from the Component and Avoiding the Thermal "Bottle-Neck" Seen in Stamped and Staked Heatsinks  Heatsinks Special Features Radius Mounted Rollers are Designed for Maximizing Heat Transfer from the Component and Avoiding the Thermal "Bottle-Neck" Seen in Stamped and Staked Heatsinks  Ohmite Heatsinks Special Features Radius Mounted Rollers are Designed for Maximizing Heat Transfer from the Component and Avoiding the Thermal "Bottle-Neck" Seen in Stamped and Staked Heatsinks   Thermal Resistance 6 °C/W  Ohmite Thermal Resistance 6 °C/W  Heatsinks Thermal Resistance 6 °C/W  Ohmite Heatsinks Thermal Resistance 6 °C/W   Type TO-268  Ohmite Type TO-268  Heatsinks Type TO-268  Ohmite Heatsinks Type TO-268   Weight 0.145 oz  Ohmite Weight 0.145 oz  Heatsinks Weight 0.145 oz  Ohmite Heatsinks Weight 0.145 oz  
電話:400-900-3095
QQ:800152669
關(guān)于我們 | Amphenol簡介 | Amphenol產(chǎn)品 | Amphenol產(chǎn)品應(yīng)用 | Amphenol動(dòng)態(tài) | 按系列選型 | 按產(chǎn)品規(guī)格選型 | Amphenol選型手冊(cè) | 付款方式 | 聯(lián)系我們
Copyright © 2017 habitrun.com All Rights Reserved. 技術(shù)支持:電子元器件 ICP備案證書號(hào):粵ICP備11103613號(hào)