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TP0002 - 

Theremo Pad; 0.50C/W Thermal Resistance; Silicon/Fibre Glass; Gray

NTE Electronics, Inc. TP0002
聲明:圖片僅供參考,請以實物為準(zhǔn)!
制造商產(chǎn)品編號:
TP0002
倉庫庫存編號:
70215873
技術(shù)數(shù)據(jù)表:
View TP0002 Datasheet Datasheet
訂購熱線: 400-900-3095  0755-21000796, QQ:800152669, Email:sales@szcwdz.com
由于產(chǎn)品數(shù)據(jù)庫龐大,部分產(chǎn)品信息可能未能及時更新,下單前請與銷售人員確認(rèn)好實時在庫數(shù)量,謝謝合作!

TP0002產(chǎn)品概述

NTE's THERMO-PADS do away with the old fashioned and messy mica wafer and conductive grease method of mounting power semiconductors. These thermally conductive insulators offer low heat transfer resistance while still providing high electrical isolation between the parts of the assembly. The elastomeric material combines the electrical isolation of rigid insulators with the ability to conform to rough surfaces and reduce contact resistance in much the same manner as thermal greases. Proper selection and use of these thermo-pads results in a securely mounted power semiconductor and minimum resistance to the heat transfer between it and the heat sink. Typical Properties Color: Gray; Test Method — Visual. Breaking Strength, Lbs./Inch: 100; Test Method — ASTM D 1458. Elongation, Percent: 4; Test Method — ASTM D 412. Volume Resistance Ohm Metre Minimum Normal: 1.0 × 1013, Test Method — ASTM D 257. Volume Resistance Ohm Metre Minimum Moist: 1.5 × 1010, Test Method — ASTM D 257. Breakdown Voltage, Minimum Normal: 5000; Test Method — ASTM D 149. Moist: 2500; Test Method — ASTM D 149. Dielectric Constant 1000 Cups (Hz): 5.5; Test Method — ASTM D 150. Continuous Use Temp. °C: –60 to +180. Thermal Conductance W/m-k: 0.7. Thermal Vacuum Weight Loss Percent (TML) Maximum As Manufactured: 0.40; Test Method — NASA. Thermal Vacuum Weight Loss Percent (TML) Maximum Post Cure 24 Hrs @ 400°F: 0.25; Test method — SP-R-0022A. Volatile Condensable Material, Percent, Maximum (CVCM) as Manufactured: 0.11; Test Method — NASA. Volatile Condensable Material, Percent, Maximum (CVCM) Post Cure 24 Hrs. @ 400°F: 0.07; Test Method — SP-R-0022A. Hardness, Shore A: 85; Test Method — ASTM D 2240. Specific Gravity: 2.0-2.1. Thickness (Expressed In Inches): 0.009 (+0.002, –0.001). Thermal Resistance (TO-3 Transistor) °C/Watt: 0.50.

TP0002產(chǎn)品信息

  Brand/Series  TP Series  
  Color  Gray  
  Dielectric Constant  5.5  
  Dimensions  1.312 L x 0.762 W In.  
  Hardness  85 Shore A  
  Material  Silicone/Fiberglass  
  Package Type  TO-66  
  Temperature, Continuous Use  -60 to 180 °C  
  Thermal Conductivity  0.9 W/m-K  
  Thickness  0.009 In.  
  Type  Thermal Pads  
  Voltage, Breakdown  4500 VAC  
關(guān)鍵詞         

TP0002相關(guān)搜索

Brand/Series TP Series  NTE Electronics, Inc. Brand/Series TP Series  Thermal Pads Brand/Series TP Series  NTE Electronics, Inc. Thermal Pads Brand/Series TP Series   Color Gray  NTE Electronics, Inc. Color Gray  Thermal Pads Color Gray  NTE Electronics, Inc. Thermal Pads Color Gray   Dielectric Constant 5.5  NTE Electronics, Inc. Dielectric Constant 5.5  Thermal Pads Dielectric Constant 5.5  NTE Electronics, Inc. Thermal Pads Dielectric Constant 5.5   Dimensions 1.312 L x 0.762 W In.  NTE Electronics, Inc. Dimensions 1.312 L x 0.762 W In.  Thermal Pads Dimensions 1.312 L x 0.762 W In.  NTE Electronics, Inc. Thermal Pads Dimensions 1.312 L x 0.762 W In.   Hardness 85 Shore A  NTE Electronics, Inc. Hardness 85 Shore A  Thermal Pads Hardness 85 Shore A  NTE Electronics, Inc. Thermal Pads Hardness 85 Shore A   Material Silicone/Fiberglass  NTE Electronics, Inc. Material Silicone/Fiberglass  Thermal Pads Material Silicone/Fiberglass  NTE Electronics, Inc. Thermal Pads Material Silicone/Fiberglass   Package Type TO-66  NTE Electronics, Inc. Package Type TO-66  Thermal Pads Package Type TO-66  NTE Electronics, Inc. Thermal Pads Package Type TO-66   Temperature, Continuous Use -60 to 180 °C  NTE Electronics, Inc. Temperature, Continuous Use -60 to 180 °C  Thermal Pads Temperature, Continuous Use -60 to 180 °C  NTE Electronics, Inc. Thermal Pads Temperature, Continuous Use -60 to 180 °C   Thermal Conductivity 0.9 W/m-K  NTE Electronics, Inc. Thermal Conductivity 0.9 W/m-K  Thermal Pads Thermal Conductivity 0.9 W/m-K  NTE Electronics, Inc. Thermal Pads Thermal Conductivity 0.9 W/m-K   Thickness 0.009 In.  NTE Electronics, Inc. Thickness 0.009 In.  Thermal Pads Thickness 0.009 In.  NTE Electronics, Inc. Thermal Pads Thickness 0.009 In.   Type Thermal Pads  NTE Electronics, Inc. Type Thermal Pads  Thermal Pads Type Thermal Pads  NTE Electronics, Inc. Thermal Pads Type Thermal Pads   Voltage, Breakdown 4500 VAC  NTE Electronics, Inc. Voltage, Breakdown 4500 VAC  Thermal Pads Voltage, Breakdown 4500 VAC  NTE Electronics, Inc. Thermal Pads Voltage, Breakdown 4500 VAC  
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