G3B15AP-XC - 

Ultra-miniature size allows high density mounting, and extremely light weight of 0.6 gram makes these switches ideal for handheld equipment. Tape-reel and stick-tube packaging allow rapid automated placement of surface mount devices.

Tape-reel packaging meets EIA-481-D Standard. Heat resistant resin used for housing, base, and plunger allows vapor phase and infrared convection reflow soldering. Combination of design features achieves total seal and allows automated processing techniques, including flux cleaning procedures: one-piece bushing and housing, rubber seals surrounding actuator and base, epoxy at joint of case and base, and molded-in, epoxy-sealed terminals. Award-winning STC contact mechanism with benefits unavailable in conventional mechanisms: smoother, positive detent actuation, increased contact stability and unparalleled logic-level reliability. (Additional STC details in Terms & Acronyms; see Supplement section.)