NeoScale® High-Speed Mezzanine System Delivering the market’s cleanest signal integrity at 28+ Gbps, Molex’s modular NeoScale™ Mezzanine System features a high-speed triad wafer design with Solder-Charge Technology™ for customized PCB routing in high-density system applications. Ideal for space-constrained designs with limited PCB real estate, the modular NeoScale® mezzanine system provides a durable and easily customizable design tool for high-density system applications. Each NeoScale triad wafer is an independent element in the housing and can be customized to a design layout. With four triad wafer configurations, customers can mix and match components to build a mezzanine solution to meet their requirements for signals supporting high-speed differential pairs (85 and 100 ohm), high-speed single-ended transmissions, low-speed single-ended signals and power contacts.