8329TCS-200ML -

ADHESIVE - THERMALLY CONDUCTIVE EPOXY, SLOW CURE

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制造商：: MG Chemicals MG Chemicals
制造商產(chǎn)品編號：: 8329TCS-200ML
倉庫庫存編號：: 70276184
技術數(shù)據(jù)表：: Datasheet

訂購熱線： 400-900-3095 0755-21000796, QQ:800152669, Email:sales@szcwdz.com

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8329TCS-200ML產(chǎn)品概述

MG Chemicals thermal adhesive is used for thermal management situations requiring superior bonding strengths, good thermal transfers, and non electrically conductive. It is great for heat sink bonding. It is also used as a high-powered LED adhesive that maximizes the lifetime of LEDs by dissipating their heat.

8329TCS-200ML產(chǎn)品信息

8329TCS-200ML相關搜索

Density 2.17 g/cm₃ MG Chemicals Density 2.17 g/cm₃ Epoxy Compounds Density 2.17 g/cm₃ MG Chemicals Epoxy Compounds Density 2.17 g/cm₃ Dielectric Strength 6.6 @ 4.188 mm kV/mm MG Chemicals Dielectric Strength 6.6 @ 4.188 mm kV/mm Epoxy Compounds Dielectric Strength 6.6 @ 4.188 mm kV/mm MG Chemicals Epoxy Compounds Dielectric Strength 6.6 @ 4.188 mm kV/mm Elongation 7.0 % MG Chemicals Elongation 7.0 % Epoxy Compounds Elongation 7.0 % MG Chemicals Epoxy Compounds Elongation 7.0 % Shelf Life 5 years years MG Chemicals Shelf Life 5 years years Epoxy Compounds Shelf Life 5 years years MG Chemicals Epoxy Compounds Shelf Life 5 years years Tensile Strength 11.4 N/mm₂ MG Chemicals Tensile Strength 11.4 N/mm₂ Epoxy Compounds Tensile Strength 11.4 N/mm₂ MG Chemicals Epoxy Compounds Tensile Strength 11.4 N/mm₂ Thermal Conductivity @ 25° C 1.44 W/(m·K) MG Chemicals Thermal Conductivity @ 25° C 1.44 W/(m·K) Epoxy Compounds Thermal Conductivity @ 25° C 1.44 W/(m·K) MG Chemicals Epoxy Compounds Thermal Conductivity @ 25° C 1.44 W/(m·K)

Density	2.17 g/cm₃
Dielectric Strength	6.6 @ 4.188 mm kV/mm
Elongation	7.0 %
Shelf Life	5 years years
Tensile Strength	11.4 N/mm₂
Thermal Conductivity	@ 25° C 1.44 W/(m·K)
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