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19-823 - 

POTTING EPOXY 8 OZ

GC Electronics 19-823
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制造商產(chǎn)品編號：
19-823
倉庫庫存編號：
70159833
技術(shù)數(shù)據(jù)表：
View 19-823 Datasheet Datasheet
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19-823產(chǎn)品概述

3M Scotch-Weld™ Epoxy Potting Compound-Adhesives

Black opaque highly filled epoxy used for potting and encapsulating electronic circuits. Use to environmentally protect or conceal circuits. This product is excellent when used with GC Chassis Boxes. Working Time (Pott Life): 1 hour. Mix Ratio: 1 to 1. Temperature Range: -40° to 300°F. Electrical Properties. Volume Resistivity: 8.3 × 10(14) ohm-cm. Dielectric Constant: 3.5 (104 CPS at 77°F). Dissipation Factor: 0.014 (104 CPS at 77°F).
Potting epoxy resin is a adhesive product, mixture of chemical composition.

19-823產(chǎn)品信息

  Chemical Component  Bisphenol-A Type Epoxy Resin/Carbon Black  
  Density, Vapor  Air  
  Dispensing Method  Bottle  
  Flash Point  +200  
  Odor  Mild Epoxy  
  Physical State  Liquid  
  Primary Type  Adhesive  
  Special Features  Kit  
  Specific Gravity  1.19  
  Standards  Complies with OSHA Hazard Communication Standard 29 CFR 1910.1200  
  Temperature, Rating  -40 to +300 °F  
  Time, Setting  1 hr.  
  Type  Potting Compound  
  Weight  8 Oz.  
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19-823相關(guān)搜索

Chemical Component Bisphenol-A Type Epoxy Resin/Carbon Black  GC Electronics Chemical Component Bisphenol-A Type Epoxy Resin/Carbon Black  Potting Compounds Chemical Component Bisphenol-A Type Epoxy Resin/Carbon Black  GC Electronics Potting Compounds Chemical Component Bisphenol-A Type Epoxy Resin/Carbon Black   Density, Vapor Air  GC Electronics Density, Vapor Air  Potting Compounds Density, Vapor Air  GC Electronics Potting Compounds Density, Vapor Air   Dispensing Method Bottle  GC Electronics Dispensing Method Bottle  Potting Compounds Dispensing Method Bottle  GC Electronics Potting Compounds Dispensing Method Bottle   Flash Point +200  GC Electronics Flash Point +200  Potting Compounds Flash Point +200  GC Electronics Potting Compounds Flash Point +200   Odor Mild Epoxy  GC Electronics Odor Mild Epoxy  Potting Compounds Odor Mild Epoxy  GC Electronics Potting Compounds Odor Mild Epoxy   Physical State Liquid  GC Electronics Physical State Liquid  Potting Compounds Physical State Liquid  GC Electronics Potting Compounds Physical State Liquid   Primary Type Adhesive  GC Electronics Primary Type Adhesive  Potting Compounds Primary Type Adhesive  GC Electronics Potting Compounds Primary Type Adhesive   Special Features Kit  GC Electronics Special Features Kit  Potting Compounds Special Features Kit  GC Electronics Potting Compounds Special Features Kit   Specific Gravity 1.19  GC Electronics Specific Gravity 1.19  Potting Compounds Specific Gravity 1.19  GC Electronics Potting Compounds Specific Gravity 1.19   Standards Complies with OSHA Hazard Communication Standard 29 CFR 1910.1200  GC Electronics Standards Complies with OSHA Hazard Communication Standard 29 CFR 1910.1200  Potting Compounds Standards Complies with OSHA Hazard Communication Standard 29 CFR 1910.1200  GC Electronics Potting Compounds Standards Complies with OSHA Hazard Communication Standard 29 CFR 1910.1200   Temperature, Rating -40 to +300 °F  GC Electronics Temperature, Rating -40 to +300 °F  Potting Compounds Temperature, Rating -40 to +300 °F  GC Electronics Potting Compounds Temperature, Rating -40 to +300 °F   Time, Setting 1 hr.  GC Electronics Time, Setting 1 hr.  Potting Compounds Time, Setting 1 hr.  GC Electronics Potting Compounds Time, Setting 1 hr.   Type Potting Compound  GC Electronics Type Potting Compound  Potting Compounds Type Potting Compound  GC Electronics Potting Compounds Type Potting Compound   Weight 8 Oz.  GC Electronics Weight 8 Oz.  Potting Compounds Weight 8 Oz.  GC Electronics Potting Compounds Weight 8 Oz.  
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