21124產品概述
NC258 has been developed to offer long pause-to-print capabilities while enhancing fine print definitions. NC258 reduces such defects as voiding and eliminates head-in-pillow. The superior wetting ability of NC258 results in bright, smooth and shiny solder joints. It also offers very low post process residues, which remain crystal clear even at the elevated temperatures required for today’s lead-free alloys.
